Pressureless Silver Sintering Die-Attach for SiC Power Devices

Die attach using silver sintering practical implementation and analysis

Silver sintering is a promising alternative to high melting point (HMP) solders which contain lead. Indeed, it offers better thermal and electrical properties, and can operate at higher temperature. Currently, several implementations of this technique are available, based on various silver particles sizes and sintering additives. This paper presents a review of the different implementations, an...

Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy

Silver sintering joints and AuGe soldering are promising technologies for high temperature (>200 C ambient) power electronics packaging. This paper presents the implementation of two silver-sintering processes with the one hand micrometer-scale silver particles, and on the other hand nano-meter-scale particles. Two substrates technologies have been investigated: A12O3 DBC and Si3N4 AMB. After t...

Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

Article history: Received 25 May 2015 Accepted 15 June 2015 Available online xxxx

Selecting Die Attach Technology for High-Power Applications Page of

From a packaging perspective, there are a number of common requirements for all these highpower applications: they must handle high electrical currents, dissipate large amounts of heat, manage thermal expansion-induced stresses for high reliability, and this must all be accomplished at low cost. Cost, in this case, includes assembly as well as materials. ROHS regulations also add some new dimen...

SiC Power Devices and Modules